| 摘要 |
<p>PURPOSE:To wash away silicon dust, etc., produced at the time of dicing operations so as to prevent the dust, etc., from adhering to semiconductor elements by performing the dicing operations while pure water is circulated on the surface of a wafer. CONSTITUTION:A wafer 3 fixed on a wafer mounting table 6 is set in a pure water tank 7 and pure water jetted from a pure water jetting nozzle 1 is circulated on the wafer 3 so as to wash away the silicon dust produced at the time of dicing operations.</p> |
