| 摘要 |
<p>PURPOSE:To increase the packing density and reliability of a semiconductor device by enclosing three or more chips, connected with lead frames through wire, in one package by transfer molding. CONSTITUTION:Three semiconductor chips 1a, 1b and 1c are arranged vertically, and to their respective surfaces, a first lead frame (2a, 2b and 2c) bonded with insulators 3a, 3b and 3c in between. The first lead frame and the chips are electrically connected through wires 5a, 5b and 5b. The first lead frame is also connected with a second lead frame (4a-2, 4b-2 and 4c-2) having external leads (4a-4 and 4b-1). This structure, except the external leads, is molded with resin 6. The lead frames may be of copper or ion-nickel alloy, and the molding material may be an epoxy resin containing a filler.</p> |
