| 摘要 |
PURPOSE:To simplify device manufacturing processes and increase the reliability of a semiconductor device and wiring by forming a device structure in which the lower of stacked semiconductor chips serves as the tab for the upper, and the electrode pads of the stacked chips are in the same directions and exposed to the same surface. CONSTITUTION:An insulator 3 such as an insulating film is placed on an underlying chips 1, and on the insulator are mounted a tab-less lead frame 4 and a chip 2. The chips 1 and 2 are interconnected through wires 5, and leads 4L are also interconnected through wires 5. There are difference in level between parts, for example, between the chip 1 and leads 4L, between the chip 2 and leads 4L, and between the chips 1 and 2. Therefore, their electrical connections are made individually depending on their combinations in accordance with a program. Since the leads 4L are thinner than the chip 2 and are arranged on the insulator 3 that is in the same plane as the chip 2, the package can be maintained thin. In addition, the lead frame does not have a tab, and a plurality of chips can be enclosed in a thin package. Therefore, it is possible to provide a large memory composed of two divided chips. |
