| 摘要 |
PURPOSE:To measure, in a nondestructive manner and with good accuracy, a stress exerted on a semiconductor device by a method wherein the stress exerted on the semiconductor device is measured by utilizing that a bonding wire connecting the semiconductor device to a lead frame is deformed by a stress at a heat treatment or by a molding resin itself during a package mounting operation. CONSTITUTION:An inductance per external terminal for a semiconductor device sealed with a molding resin is normally at several nH. When a bonding wire is deformed by a stress caused by the molding resin, the wire is deformed so as to draw a loop and the inductance is increased by about 20%. When such a change in the inductance is measured at the external terminal for the resin- molded semiconductor device, the stress inside the molding resin can be measured easily. |
