| 摘要 |
PURPOSE:To reduce the price and size of a device by using an LCC substrate with internal electrodes that contain a mount land for placing the semiconductor device and a stitch land for connecting the bonding wire and external electrodes in the surrounding area and a sealing resin inserted on the inside of a frame- shaped resin film that almost completely covers a portion of the internal electrodes and the upper section of the external electrodes. CONSTITUTION:A stitch land 4 for wire bonding connections and an external electrode 3 for LCC solder mounting are formed as a conductive layer on a glass epoxy substrate 1 and the upper section of the external electrode 3 is almost entirely covered by a resin film 5. Since the upper section of the external electrode is almost entirely covered by the frame-shaped resin film 5 (equivalent to the conventional conductive protection film), it is not necessary to separately establish the conventional flow stopping resin frame outside the conductive protection layer. |
