| 摘要 |
PURPOSE:To eliminate solder wicking phenomenon and enable working efficiency to be improved by performing a treatment with a poor solder wetting property onto an upper part of a lead terminal. CONSTITUTION:A chip 1 of an integrated circuit, a tab 2, an insulation object container 3 of epoxy resin mold including these, and a lead terminal 4 whose one terminal is fixed at the insulation object container 3 and whose the other terminal is extended outward are provided and then aluminum or nickel is plated on a surface of a part 6 excluding a junction part 5 of the lead terminal 4 which is bent in U-character shape, thus resulting in a surface 7 with a poor solder wettability. Therefore, when mounting on a printed-circuit board, a part of the surface 7 with a poor solder wetting property prevents wicking of solder, prevents solder at the connection part from being lost, enables preliminary heating time to be reduced, and enables working efficiency to be improved. |
