| 摘要 |
<p>A contamination control apparatus for sealable interconnection with a plating tank (12) of the character used in the electrodeposition of an electrodeposit onto a substrate. The apparatus includes a capture means (16) carried by a hood means (14), which permits the free escape of hydrogen, but blocks the escape of most metal atoms released from the plating solution. The metal atoms are returned to the solution by force of gravity thereby eliminating the need for complex ventilating and fume scrubbing systems.</p> |
