| 摘要 |
<p>A method and a device for interconnecting stacked semiconductor wafers each of which includes an integrated circuit. For this purpose, the semiconductor wafers (P) are stacked and rigidly fixed to one another. In one embodiment, their connection pads are each connected by a wire (F) to any one of the sides of the stack except for one (B), which is in contact with a printed circuit. The connection of the wafers to one another and to the printed circuit is made on the sides (FV, FS, FL) of the stack.</p> |
