发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PURPOSE:To obtain a positive type photoresist composition having excellent resolving power, sensitivity, heat resistance and developing properties, comprising a specific alkali-soluble novolak resin and a sensitized material consisting essentially of a 1,2-quinonediazide compound. CONSTITUTION:(A) 100 pts.wt. alkali-soluble novolak resin obtained by reacting a (substituted) phenol with an aldehyde in the presence of a silica magnesia- based solid catalyst [preferably MIZUKA LIFE P-1 manufactured by MIZUSAWA KAGAKU KOGYO KK] at 70-160 deg.C for 3-50 hours, having 2,000-30,000 weight-average molecular weight is blended with (B) 5-100 pts.wt., preferably 10-50 pts.wt. sensitized material consisting essentially of an ester of a 1,2-quinonediazido-5-(and/or -4-)sulfonic acid and a polyhydroxy aromatic compound to give a positive type photoresist composition for fine processing.
申请公布号 JPH04178451(A) 申请公布日期 1992.06.25
申请号 JP19900304268 申请日期 1990.11.09
申请人 FUJI PHOTO FILM CO LTD 发明人 UENISHI KAZUYA;TAN SHIRO;KAWABE YASUMASA;KOKUBO TADAYOSHI
分类号 C08G8/08;C08L61/04;C08L61/06;G03F7/022;G03F7/023;H01L21/027 主分类号 C08G8/08
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