发明名称 Waffleline-configured surface-mount package for high frequency signal coupling applications
摘要 A waffeline-configured, surface-mount transmission line module contains a two-dimensional arrangement of periodically distributed conductive surface mesas and channels. Within the channels are segments of dielectrically surrounded conductor. The geometry of the arrangement of segments among the waffleline channels is defined in accordance with the intended signal coupling functionality of the interconnect structure. For example, in the case of a signal splitting application, the conductor segments may be arranged in a tree-like configuration between an input port and multiple output ports. Isolation resistors may be disposed within the channels of the waffleline between adjacent locations of diverging conductor runs among the mesas of the waffleline. The resulting transmission line module is then surface-mounted on the same printed wiring board as the signal processing components it is to interconnect, and respective portions of the segments of dielectrically surrounded conductor within the channels of the waffleline module are connected to signal ports of adjacent signal processing components. Because each waffleline interconnect module is relatively thin, multiple modules may be mounted in a stacked configuration on the printed wiring board to realize a three-dimensional waffleline module structure, with intermodule vias and interconnects provided between selected locations of conductor segments of adjacent layers.
申请公布号 US5124677(A) 申请公布日期 1992.06.23
申请号 US19900571082 申请日期 1990.08.22
申请人 HARRIS CORPORATION 发明人 HECKAMAN, DOUGLAS;CARUSO, DIANE G.
分类号 H01P5/12;H05K1/02;H05K1/05;H05K1/14;H05K3/10;H05K3/34 主分类号 H01P5/12
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