发明名称 BARRIER LAYER AND ORIFICE PLATE FOR THERMAL INK JET PRINT HEAD ASSEMBLY AND METHOD OF MANUFACTURE
摘要 This application discloses a thermal ink jet print head and method of manufacture featuring an improved all-metal orifice plate and barrier layer assembly. This assembly includes constricted ink flow ports to reduce cavitation damage and smooth contoured convergent ink ejection orifices to prevent "gulping" of air during an ink ejection process. Both of these features extend the maximum operating frequency, fmax, of the printhead. The nickle barrier layer and the underlying thin film resistor substrate are gold plated and then soldered together to form a good strong solder bond at the substrate - barrier layer interface.
申请公布号 CA1303903(C) 申请公布日期 1992.06.23
申请号 CA19870534037 申请日期 1987.04.07
申请人 HEWLETT-PACKARD COMPANY 发明人 CHAN, CHOR S.;HAY, ROBERT R.
分类号 B21D53/00;B41J2/01;C25D1/02;G03C5/00;H01L21/306 主分类号 B21D53/00
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