| 摘要 |
PURPOSE:To thermally couple surface mounting components with each other with ease and to enable a printed wiring board to be improved in degree of freedom of circuit design and offered at a low cost by a method wherein an insulating layer which electrically insulates the thermally coupled surface mounting components from each other is interposed between a housing layer and a terminal layer. CONSTITUTION:Recesses 11a and 11b where surface mounting components 80 are housed and heat conducting sections 12 (through-holes 12) which are provided to the recesses 11a and 11b to conduct heat released from the surface mounting components 80 are provided to a housing layer 10. Then, a conductor circuit 22 of solid pattern provided onto an insulating base material 23 is connected to a terminal layer 20, and a through-hole 24 is provided at a position correspondent to the through-hole 12 provided to the housing layer 10. The terminal layer 20 is bonded to an insulating layer 30 through the intermediary of an adhesive agent 40, and the land 12a of the through-hole 12 provided inside the housing layer 10 is thermally coupled with the land 24a of the through-hole 24 provided to the terminal layer 20. |
