| 摘要 |
PURPOSE:To simplify work and reduce cost, by performing inspection in the state that insulative resin connecting a semiconductor element and a substrate is weakly cured or bonded, and completing the curing and the bonding of the insulative resin which has passed the inspection. CONSTITUTION:When a semiconductor element 6 and a substrate 1 are pressurized by a pressing jig 7, insulative resin 5 between a metal protrusion 3 and a wiring pattern 2 is pushed out, and electric continuity is generated. At this time, the element 6 and the substrate 1 are weakly mechanically retained 8. Then a semiconductor device is inspected by using a pin probe. When defects are found, the element 6 and the substrate 1 are replaced, and the preliminary bonding is again performed. When the device has passed the inspection, an energy sufficient to exhibit curing force or bonding force is applied to the resin 5, thereby completing electric.mechanical connection and hold. |
