| 摘要 |
PURPOSE:To reduce an X and a Y stage in weight and size while reducing an Abbe error due to the positioning of a wafer by forming reflecting mirror surfaces on a specific end surface of a fixation means, and reflecting the beam of length measuring means by the reflecting mirror surfaces and positioning the wafer. CONSTITUTION:The wafer 2 is fixed to the attraction part of the fixation means 3b and driven by a driving means in a specific direction. The reflecting mirror surfaces are formed on the specific end surfaces 20x and 20y of the fixation means 3b and the beams 12a of the length measuring means 12X and 12Y is reflected by the reflecting mirror surfaces respectively to position the wafer 2. Consequently, the Abbe error due to the positioning of the wafer is reduced to position the wafer with high accuracy, and the driving means for driving the wafer is reduced in weight and size. |
