| 摘要 |
PURPOSE:To make a heat capacity large, to satisfactorily absorb heat generated at a semiconductor chip and to reduce a temperature rise by a method wherein an island at a lead frame is formed to be thicker than an outer lead. CONSTITUTION:A semiconductor chip 3 is fixed and bonded to an island at a lead frame; an electrode at the chip 3 and a bonding part at an outer lead 2 on the lead frame are connected by using a metal thin wire 4; after that, this assembly is sealed with a resin 5. The sheet thickness of the island part 1 to which the chip 3 is fixed and bonded is thicker than the lead 2; the rear of the island part 1 is revealed on the surface of the sealing resin body 5. After the lead 2 has been pulled out transversely from the side face of the resin body 5, it is immediately bent downward so as to run along the side face. It is bent inward at the bottom face of the resin body 5; its bent outer face is mounted on a mounting board by a plane soldering operation. Thereby, an apparatus can be mounted on a frame via an insulating sheet whose thermal conductivity is good, and desired electric power can be applied. |
