| 发明名称 |
THERMALLY CONDUCTIVE ADHESIVE |
| 摘要 |
<p>Adhesive resins are filled with carbon fibers that have a three-dimensional structure. The fibers have variable lengths and widths. The fiber filled adhesive exhibits high thermal conductivity values. Electronic systems having components bonded by a layer of these adhesive resins have high through-the-thickness thermal conductivity. <IMAGE></p> |
| 申请公布号 |
IL97957(D0) |
申请公布日期 |
1992.06.21 |
| 申请号 |
IL19910097957 |
申请日期 |
1991.04.25 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
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| 分类号 |
C09J11/04;C09J9/02;C09J201/00;H01L23/482;H01L23/498;H05K1/02;H05K3/30;(IPC1-7):C09J/ |
主分类号 |
C09J11/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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