| 摘要 |
PURPOSE:To eliminate the need of a process for removing a resin film so as to improve the reliability at the mounting time by applying a photoreactive resin after a lead frame and semiconductor chip are wire bonded to each other and removing an outer lead section, leaving an inner lead section as it is, after developing the resin by selectively irradiating the resin with light, and then, sealing the inner lead section and semiconductor chip with a resin. CONSTITUTION:The inner leads 1A of a lead frame 1 are connected with a semiconductor chip 2 through wires 3, such as aluminum wires, etc. The frame 1 and chip 2 are coated with a resin film 4 by dipping them in the solution of a resin which hardens when the resin is irradiated with light. Then the resin film 4 is irradiated with light through a mask 5 selectively covering outer leads 1B. When they are dipped in a developing solution after irradiation, the resin film 4 is removed from the outer lead sections 1B, leaving the resin film 4 on the surface of the inner leads 1A and semiconductor chip 2 which are irradiated with the light. Then the inner lead sections and semiconductor chip are sealed with an epoxy resin, etc. |
