发明名称 LIGHT-TRANSMISSIBLE RESIN-SEALING TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve productivity without hindering optical characteristics by providing the surface of light-transmissible resin with a recess and by attracting an adhesive member to the recess, even if the adhesive member protrudes around a glass member. CONSTITUTION:The external shape of the title device is formed by a transfer mold method through the use of a light-transmissible resin 5. In this case, when a metal mold used at the time of transfer mold is provided with a square-shaped projection in a part corresponding to the part between a light-transmissible resin 5 surface corresponding to the bonded surface of a glass member 6 and a light-transmissible resin 5 surface corresponding to the bonded surface of an equipment body 9, the recess 8 of the light transmissible surface of a forming body is formed simultaneously at the time of forming a transfer mold. Subsequently, an adhesive member 7 is spot- attached to the resin 5 surface by a dispenser, the glass member 6 is placed on the surface and pressed by a collet to form a plane, and the adhesive member 7 is hardened so that the glass member 6 is bonded to the light-transmissible resin 5 surface. At the time of bonding the member 6 to the resin 5 surface, the adhesive member 7 protruding onto the resin 5 surface is attracted to the recess 8.
申请公布号 JPH04171866(A) 申请公布日期 1992.06.19
申请号 JP19900299439 申请日期 1990.11.05
申请人 CANON INC 发明人 KOMORI HISATANE
分类号 H01L23/28;H01L31/02;H01L33/54;H01L33/62 主分类号 H01L23/28
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