发明名称 BUMP BONDING DEVICE
摘要 PURPOSE:To form the bump of short tact and less dispersion in shape by a method wherein the bump is formed in one action while a ball is made during the bump formation step. CONSTITUTION:A ball 7 is made on the front end of a wire 3 using an electric torch 17, next, the ball 7 is disconnected from the wire 3 simultaneously with the inverse action of a bonding tool 8 to pick up the ball 7. Next, the bonding tool 8 is reset to the regular position to form a bump on the position 2 to be bonded while the wire 3 is fed to make a new ball again. Through these procedures, the bumps are continuously formed by repeating these steps.
申请公布号 JPH04171826(A) 申请公布日期 1992.06.19
申请号 JP19900300757 申请日期 1990.11.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MATSUMURA SHINYA;KABESHITA AKIRA;KANAYAMA SHINJI;ANDO TAKEO;SHIDA SATOSHI
分类号 H01L21/60;H01L21/321 主分类号 H01L21/60
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