发明名称 METHOD OF PROCESSING CIRCUIT SUBSTRATE
摘要 <p>PURPOSE:To accurately adjust the electric resistance value of a resistor to be formed on a circuit substrate composed of aluminum nitride sintered body and to prevent the corrosion of aluminum nitride sintered body, the change of properties of a circuit part formed on a substrate composed of aluminum nitride sintered body, etc., by removing a part of aluminum nitride sintered body through the use of a water jet technic at the time of processing the circuit substrate composed of alminum nitride sintered body. CONSTITUTION:When abrasive jet is injected by a specific pressure onto a substrate 100 composed of, e.g. aluminum nitride sintered body, through holes 102 are formed in the aluminum nitride substrate 100. In like manner, also, when a nozzle is moved at a predetermined feed rate while the abrasive jet is injected onto the aluminum nitride substrate 100, two snap lines 101 composed of recesses are formed crosswise. When these snap lines 101 are used for conducting a chocolate breaking process, the aluminum nitride substrate 100 is divided in four. Accordingly, neither deleterious deposit exists in the obtained aluminum nitride substrate nor deterioration of insulating properties is found in the processed part of the snap line.</p>
申请公布号 JPH04171884(A) 申请公布日期 1992.06.19
申请号 JP19900300348 申请日期 1990.11.05
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAMAKAWA AKIRA
分类号 H01C17/242;B26F3/00;H01C17/24;H01C17/245;H01L21/48;H05K1/02;H05K1/03;H05K1/16;H05K3/00;H05K3/04 主分类号 H01C17/242
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