发明名称 BONDING METHOD FOR RESIN
摘要 <p>PURPOSE:To conduct without generating dielectric breakdown of resin in the state of bringing a couple of electrodes into contact with the surface of resin laminated with a heat generating body layer interposed therein, high frequency voltage, by setting the resistance of heat generating body layer in an electric line and the area of electrodes under the specified conditions at that time. CONSTITUTION:Resin sheets 1A and LB to be bonded together are laminated, and a resistant heat generating body 2 is interposed between the laminates. Electrodes 3A and 3B are disposed on the surface of the resin sheet 1A positioned on the sections 2a and 2b of the resistant heat generating body 2, and a high frequency power source 4 is connected with the electrodes 3A and 3B. High frequency voltage of 10<5> to 10<8>Hz is applied, and power is applied to the heat generating body layer indirectly through a resin layer. At that time, the resistance R of the heat generating body layer in the electric line and the area S of electrodes are set as shown by the formula I so as to apply power without generating dielectric breakdown of the resin sheets in the electrode sections. In the formula, (z) represents impedance (OMEGA.cm<2>) per unit area of a capacitor formed on the electrode section using resin as a dielectric medium, and E represents dielectric strength V for the overall thickness of resin and P represents the power W to be supplied to the heat generating layer.</p>
申请公布号 JPH04173232(A) 申请公布日期 1992.06.19
申请号 JP19900300874 申请日期 1990.11.06
申请人 DAI ICHI HIGH FREQUENCY CO LTD;NIPPON STEEL CORP 发明人 TANIGUCHI YASUYUKI;MORISHITA YOSHIYUKI;KOBAYASHI RYOJI;YOSHITOME TAKAHIRO;TSUCHIDA ISAMU;YOSHIDA KOTARO
分类号 B29C65/04;B29C65/34 主分类号 B29C65/04
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