| 摘要 |
PURPOSE:To lower unnecessary radiation to a low level and, at the same time, to prevent the occurrence of malfunctions by providing a film of the same material as that of a wiring pattern on the wiring pattern forming surface, at a portion except the wiring pattern, of an insulating substrate facing the active element forming surface of a semiconductor element. CONSTITUTION:A wiring pattern 2 is formed on a substrate 1 so that part of the pattern 2 can face metallic projections 3 and the projections 3 electrically connect electrodes on a semiconductor element 6 to the pattern 2 on the substrate 1. An insulating resin 5 has such a property that the resin 5 is hardened or becomes to have an adhesive strength when the resin 5 is subject to external energy, such as light, etc., and when the projections 3 on the element 6 are pressed against the pattern 2 on the substrate 1, the resin put between them is pushed out and the projections 3 are electrically connected to the pattern 2. When the resin 5 is pushed out, the external energy is applied to the resin 5. At the same time, an electromagnetic shield film 7 is formed of the same material as that of at least one layer of the pattern 2. |
