| 摘要 |
PURPOSE:To obtain a positive type photosensitive heat resistant material which permits patterning with direct light and electron rays, obviates the disturbance of the pattern and has high heat resistance and high resolution by incorporating a polymer having specific isoimide structure therein. CONSTITUTION:This photosensitive material contains the polymer having the isoimide structure expressed by the formula. The polymer expressed by the formula can be synthesized by the ring closure of a polyamide acid by using a dehydrating agent such as cyclohexyl carbodiimide. This positive type photosensitive heat resistant material is preferably used in the form of a soln. of 10-50wt% in an org. solvent and the concn. thereof is selectable as desired according to the conditions for work. The swelling, etc. by a developing soln. is sliminated and the high resolution is obtd. Curing is induced by the thermal transfer in the molecule and since there are no increase and decrease of the weight, there is no disturbance of the pattern; further the high heat resistance is obtd. from the imidization by heating. |
