发明名称 MANUFACTURE OF METAL-CLAD LAMINATE BOARD
摘要 <p>PURPOSE:To ensure a reliability test even with a very thin base material layer by superimposing on one surface of a prepreg a metal foil with four sides each side being longer by a predetermined length than the prepreg and an upper mirror plate of the same size as the former, and further superimposing on the opposite surface a metal foil with four sides each side being shorter by a predetermined length than the prepreg and a lower mirror plate of the same size as the upper mirror plate. CONSTITUTION:A prepreg 2 is held between a metal foil 1 with its four sides, each side being longer about 5-150mm than the prepreg and a metal foil 8 with four sides, each side being shorter by about 5-100mm than the prepreg, and further an upper mirror plate 3 of the same size as the metal foil 1 is superimposed on the prepreg and a lower mirror plate 3 of the same size as the lower mirror plate superimposed. Further, a mold-release sheet 4 is bonded to the inner surface of the lower mirror plate 3 so as to overlap the end of the metal foil 8. The constituent material described above is heated and pressurized and molded to yield a metal-clad laminate board Hereby, there can securely be performed an electrical raliability test of the metal-clad laminate board comprising an about 50-100mum thick insulating base material before processing a circuit.</p>
申请公布号 JPH04171794(A) 申请公布日期 1992.06.18
申请号 JP19900298076 申请日期 1990.11.02
申请人 HITACHI CHEM CO LTD 发明人 YAMAKAWA MASAE
分类号 B32B15/08;B29C43/18;B29C43/20;B29C43/58;B29K105/22;B29L9/00;B29L31/34;B32B37/00;H05K3/00;H05K3/38 主分类号 B32B15/08
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