DOUBLE SURFACE GRINDING DEVICE

摘要

PURPOSE:To attain a good ground surface while restricting a scar or the like on the ground surface of a workpiece due to ground chips or abrasive grains by tilting an entire device including upper and lower surface plates during grinding process. CONSTITUTION:Entire device including an upper and a lower surface plates 2 and 3 is tilted as required, namely during grinding process. This causes ground chips and abrasive grains to be discharged. Grooves are provided on upper and/or lower surfaces of a carrier of both side grinding. As a result, high accuracy ground surface free from scars is provided on the workpiece.