| 摘要 |
PURPOSE:To polish a wafer with high accuracy by suspending the rotation of a weight by a rotation checking means. CONSTITUTION:The whole surface of a plate 2 is uniformly pressed by a flexible membrane 9 with fluid regulated in pressure, which is injected out of a fluid supply pipe 10, and when a turn table 7 and a top ring are rotated by a rotation mechanism while grinding lubricant is being applied onto a cloth 8 out of a nozzle 11, the lower surface of a wafer 1 is thereby polished at suitable polishing speeds. Since the weight 6 is rested on a resting table 12 while being fixed onto a top ring spindle 14 which is not rotated because of a rotation checking arm 13 penetrating through the weight, the weight 6 is therefore not rotated at all, even if a head is rotated. |
