发明名称 |
METHOD AND APPARATUS FOR SOLDER LEVELING OF PRINTED CIRCUIT BOARDS |
摘要 |
Disclosed is a method and apparatus for fabricating workpieces such as printed circuit boards (10) which include blowing excess solder off the board by a hot air solder leveling technique. A converging/diverging airknife design (32) creates a shock wave, causing a high pressure, low velocity flow pattern which removes solder from the through-holes (13) in the board while leaving sufficient solder on the surface mount features (11). |
申请公布号 |
CA2054407(A1) |
申请公布日期 |
1992.06.18 |
申请号 |
CA19912054407 |
申请日期 |
1991.10.29 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
PARKER, JOHN L., JR. |
分类号 |
B23K1/08;B23K1/018;B23K101/42;H05K3/24;H05K3/34 |
主分类号 |
B23K1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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