Treated semiconductor disc drying system - uses hot immersion bath with simultaneous raising of carrier and lowering of bath level

摘要

The drying system uses a hot H2ODI bath into which a number of discs (12), supported in a carrier (10), are lowered. The discs (12) are maintained in defined relative positions via the carrier (10) during a given dwell time, after which the level in the bath is lowered and the carrier (10) is raised. The lowering of the level in the bath ensures that only the bottom edge of each disc (12) remains immersed, the discs (12) being removed from the carrier in this position. ADVANTAGE - Fully automated process.