MOUNTING DEVICE FOR MOUNTING AN ELECTRONIC DEVICE ON A SUBSTRATE BY THE SURFACE MOUNTING TECHNOLOGY

摘要

A mounting device for mounting an electronic device on a substrate is described. The electronic device (3) has a plurality of interconnection pins (3a) for engagement with corresponding through-holes on an interconnection circuit board (1) for electric interconnection. The mounting device comprises a plate member (6) of an insulating material provided with a plurality of conter-bores (6b) on an upper major surface of the plate member in correspondence to the interconnection pins of the electronic device, a plurality of through-holes (6a) provided on the plate member in correspondence to each of the counter-bores in a concentric relationship to the counter-bore, and a plurality of solder rings (7) provided on the plurality of counter-bores.