Package for IC comprises carrier and encapsulating agent - of moulded round carrier, with opening for IC

摘要

Package for an integrated circuit consists of a carrier and an encapsulating element. The encapsulating element consists of a liq-crystalline polymer compsn, mould round the carrier with an opening for taking up the integrated circuit. The liq-crystalline polymer in the polymer compsn has a max pressure-flow index (PFI) of 8.5 g/10 mins. Liq-crystalline polymer compsn is pre-moulded by injection moulding to form the encapsulating system. Pref the liq-crystalline polymer compsn comprises 20-70 wt% units from p-hydroxybenzoic acid, 5-50 wt% units obtd from biphenol and/or hydroquinone, 5-50 wt% units obtd from terephthalic and/or isophthalic acid, and 1-60 wt% of 1 or more fillers. Sealer for sealing an opening of a pre-moulded encapsulating element made from a liq-crystalline polymer compsn, and an electronic component consisting of an integrated circuit applied to a carrier and surrounded by an encapsulating element are also claimed.