| 摘要 |
<p>An apparatus for use as a substrate assembly for providing electrical connections in a multiaxial transducer is disclosed. The multiaxial transducer includes transducer die elements, which are electrically connected to the substrate assembly. The transducer die elements each have a sensitivity axis and are mounted on the substrate such that their sensitivity axes are non-parallel. The substrate comprises at least two modules wherein each module is fabricated substantially identically to the other and further wherein each module is oriented along a different axis corresponding to the orientation of the sensitivity axes. A plurality of electrical pads are affixed to the substrate so as to allow for pad-to-pad connections from one module to the other and further provide a ratio of substrate module bonding pads to transducer die bonding. A multiaxial transducer interconnection apparatus. The apparatus comprises first, second and third substrate modules each having a plurality of electrical tracks thereon. A portion of the electrical tracks is structured and arranged to interconnect the substrate modules in an orthogonal relationship to each other. The plurality of tracks on each substrate module is further arranged to form a pattern identical to the plurality of tracks on the other substrate modules. The substrate modules each include a mounting region whereon transducer die elements are mounted. One alternate embodiment of the invention would include a base upon which the modules would mount. Another alternate invention of the invention employs a chip carrier to support the multiaxial transducer of the invention. <IMAGE></p> |
