VERFAHREN ZUM DURCHFLUTEN VON BOHRUNGEN IN PLATTENFOERMIGEN WERKSTUECKEN, INSBESONDERE LEITERPLATTEN, UND VORRICHTUNG HIERFUER

摘要

Disclosed is a process for throughplating bores in plate-like workpieces, in particular circuit boards, and a device for carrying out the process. The aim of the invention is to make it possible to carry out bore throughplating in a continuously operating installation. The invention calls for a fluid to be fed concentrically to a driven roller with valves which open apertures only during contact with the circuit board. A second roller holds the circuit board against the first roller. This device enables roller-gap losses to be minimized, thus giving controlled throughplating and hence reducing considerably the required pump rating.