发明名称 |
LASER SOLDERING SYSTEM FOR SMD-COMPONENTS |
摘要 |
The invention relates to a CW-Nd:YAG Laser soldering system for SMD-components by means of which the soldering may be shortened by the simultaneous feeding of solder, multiple radiation, ER-absorber, flux or reaction gas, and an optimizing of the Z-adjustment of the laser spot or spots and the laser power per soldering point can be controlled. Embodiments are explained and are illustrated schematically in the figures of the drawing.
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申请公布号 |
US5122635(A) |
申请公布日期 |
1992.06.16 |
申请号 |
US19900619970 |
申请日期 |
1990.11.30 |
申请人 |
MESSERSCHMITT-BOLKOW-BLOHM GMBH |
发明人 |
KNOEDLER, DIETER;MOELLER, WERNER;VAYHINGER, KAI-UWE |
分类号 |
B23K26/00;B23K1/005;B23K26/03;B23K26/067;B23K26/12;B23K26/18;H05K3/34;H05K13/02;H05K13/04 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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