| 摘要 |
<p>PURPOSE:To establish a reliable electrical connection through soldering by setting the thickness at a part, where an external lead of a semiconductor contacts with a circuit board, thinner as compared with other parts. CONSTITUTION:External leads 12 are led out from the side face of a rectangular parallelepiped enclosure 11 composed of resin and the ends of the leads are bent in right angle on the bottom of the enclosure. Thickness at the flat part of each lead 12, which is electrically connected through soldering 13 with a wiring pattern 15 formed on a circuit board 14, is halved (250mum) through press work as compared with initial thickness (500mum). Consequently, the solder 13 can creep sufficiently upto the top face of the lead 12 resulting in a highly reliable semiconductor device.</p> |
