| 发明名称 |
LEAD FRAME HAVING POLYMER COATED SURFACE PORTIONS |
| 摘要 |
A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.
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| 申请公布号 |
US5122858(A) |
申请公布日期 |
1992.06.16 |
| 申请号 |
US19900580696 |
申请日期 |
1990.09.10 |
| 申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;FISTER, JULIUS C.;VIOLETTE, GERALD N. |
| 分类号 |
H01L23/31;H01L23/495 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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