| 摘要 |
PURPOSE:To improve dimensional dispersion in a wafer surface and between wafers and between lots by installing a developing stage with a plane oppositely faced to a photo-resist surface and forming a plurality of treating-liquid discharge openings to the plane of the stage. CONSTITUTION:A treating surface is oppositely faced and held to a developing stage 5 by a wafer chuck 1 in a previously exposed and treated wafer 2, the stage 5 is supplied with a developer 6 from developer discharge openings 3, and the developer is sustained by surface tension. The chuck 1 is lowered, the surface of the wafer 2 is bonded in parallel with the stage 5, and developing is started while the wafer 2 is turned in the direction R. Developing is completed, rinsings 4 are fed from a rinsing discharge opening 4 at the center of the stage 5, the developer 6 on the wafer 2 is washed away, and the surface of the wafer 2 is rinsed. Rinsing is completed, and the wafer 2 is dried, and forwarded to the next process. Accordingly, developing uniformity in a wafer 2 surface is improved and dimensional dispersion in the wafer surface is bettered, and dimensional dispersion between the wafers and between lots can further be enhanced. |
