| 摘要 |
PURPOSE:To prevent exfoliation of metal frame effectively and to enhance heat conduction of a package by forming an insulating substrate of sintered aluminum nitride and forming the metal frame of a metal having thermal expansion coefficient in the range of 4.0-5.0X10<-6>/ deg.C (20-400 deg.C). CONSTITUTION:Since an insulating substrate 1 is composed of sintered aluminum nitride which conducts heat easily, when a semiconductor integrated circuit element 4 is fixed on the bottom of a recess in the substrate 1 and operated, the substrate 1 directly conducts and absorbs heat produced from the element 4 and then dissipates the heat efficiently to the atmosphere. Furthermore, when a metal frame 6 is brazed to a metallized layer 5 applied on the substrate 1, a high thermal stress due to different thermal expansion coefficient is not produced between the substrate 1 and the frame 6 nor the high thermal stress is present at the brazed part.
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