发明名称 |
Method of achieving selective inhibition and control of adhesion in thick-film conductors |
摘要 |
A technique for providing controlled adhesion of a portion of a printed conductor to a circuit board employs an inhibitor layer between the circuit board and the portion of the printed conductor where such controlled adhesion is desired. The inhibitor layer is formed using a mixture of finely divided alumina powder and a glass frit, which are both suspended in an organic screening agent. An electrical module connected between controllably adherent conductor portions is thereby able to move to relative mechanical stresses.
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申请公布号 |
US5122929(A) |
申请公布日期 |
1992.06.16 |
申请号 |
US19890297201 |
申请日期 |
1989.01.17 |
申请人 |
DELCO ELECTRONICS CORPORATION |
发明人 |
PALANISAMY, PONNUSAMY;SARMA, DWADASI H. R.;HEARN, JOHN A.;SCHWARZ, DWIGHT L. |
分类号 |
H01L21/48;H01L23/498;H01L23/538;H05K1/03;H05K1/09;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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