| 摘要 |
PURPOSE:To reduce a defect occurrence rate in the manufacture of the surface acoustic wave element by deviating a crystal axis of a crystal substrate for the surface acoustic wave element from an application direction of an ultrasonic wave by 90 deg. when a wire and an interdigital electrode are connected by the combinational use of thermal compression ball bonding and the ultrasonic waves. CONSTITUTION:An interdigital electrode 3 is formed on the surface of a crystalline substrate 1. When the wire 2 is bonded on a thin film of the interdigital electrode 3, the bonding using the ball of the thermal compression ball bonding method with the conventional use of ultrasonic waves is adopted and the bonding state is shown in a cross section in the lower figure. Moreover, the application direction of the ultrasonic wave is deviated from the crystal axis of the crystalline substrate 1 by 90 deg.. Thus, shock at the pressing of the wire 2 is reduced and exfoliation of the interdigital electrode 3 or the generation of cracks of the substrate 1 is prevented. |
