| 摘要 |
PURPOSE:To stably perform connection with a printed wiring board by employing a method of thermocompression bonding by a parallel gap system at the connection part of the circuit substrate of a microwave integrated circuit with a neighboring printed wiring board. CONSTITUTION:A load can be reduce to about 1/10 compared with a heater chip system by employing the thermocompression bonding by the parallel gap system for the connection method of the microwave integrated circuit 2 with the printed wiring board 1. A joggling pattern is employed also for the shape of an electrode 4 to reduce a heating value the application of the thermocompression bonding by the parallel gap system. Thereby, reliability and quality in the connection on the printed wiring board can be improved, and working time can be shortened, and also, a cost can be reduced. |
