发明名称 BONDED MAGNET COMPOSITION
摘要 PURPOSE:To obtain the bonded magnet composition which will be used as the material for a low-priced bonded magnet, having stabilized magnetic characteristics, which is hardly oxidized even under a severe environment of high temperature and high humidity by a method wherein the title magnet composition is composed of the soldering powder, having specific melting temperature, and magnetic alloy powder. CONSTITUTION:The title magnet composition is composed of soldering material powder, having the melding temperature of 150 to 300 deg.C, and magnetic alloy powder. There is no special restriction in composition for powder type soldering material if it has the melting temperature of 150 to 300 deg.C, and Cd-Zn, Pb-Sb and the like are enumerated as the main component. Also, as magnetic alloy powder, magnetic alloy powder having a fundamental composition of R-T-B (R is Nd and/or Pr or a part of them is replaced with one or two or more kinds of rate-earth elements, T is a transition metal, and B is boron) is considered suitable. As a result, no rust is generated even when the above-mentioned material is used under high humidity, and a magnetic composition having stabilized magnetic characteristics can be obtained.
申请公布号 JPH04167503(A) 申请公布日期 1992.06.15
申请号 JP19900295062 申请日期 1990.10.31
申请人 SHIN ETSU POLYMER CO LTD 发明人 HIRUMA NOBUYUKI;KAWAI TAKASHI
分类号 C22C1/04;C22C19/07;H01F1/053;H01F1/057;H01F1/08 主分类号 C22C1/04
代理机构 代理人
主权项
地址
您可能感兴趣的专利