| 摘要 |
PURPOSE:To prevent the thermal deterioration of components by welding a fused conductor wire to the wire bonding point of circuit components to be wire-bonded mounted on a circuit board while the wire bonding point is heated with a hot blast blown upon the point. CONSTITUTION:A fused conductor wire 2 is welded to the wire bonding point of a bare chip 14 which is mounted on a circuit 12 as components to be wire- bonded while a hot blast 24 is blown upon the wire-bonding point. Since a circuit element and a bonding wire 2 are connected to each other by placing the fused front end section of the wire 2 on the heated wire-bonding surface and the wire-bonding surface is selectively heated by the hot blast, heating of the components other than a semiconductor device can be prevented. Therefore, the thermal deterioration of the other components can be prevented and, at the same time, collective mounting of parts can be performed, since even parts having thermal bearing forces can be mounted on a circuit board before wire bonding. |
