| 摘要 |
A multi-layer laminated molding having a layer structure, in which there are laminated a main material layer having as its main component polyethylene resin on the outside and a saponified material layer of ethylene-vinyl acetate copolymer or a layer of polyamide resin on the inside via at least a bonding material layer, is disclosed. Said bonding material layer comprises: A) a resin selected from the group consisting of: 1) a high density polyethylene resin having specific physical properties, 2) a linear low density polyethylene resin having specific physical properties, 3) a sophisticated high density polyethylene resin obtained by grafting an unsaturated carboxylic acid and the like with said resin (1), and 4) a modified linear low density polyethylene resin obtained by grafting an unsaturated carboxylic acid and the like to the said resin (2), which resin has 60-95 wt.% of polyethylene resin containing 0.1 wt% or more of the resin (3) and/or the resin (4); and B) a resinous composition containing 40-5 wt.% of a linear ultra low density polyethylene resin having specific physical properties, having a density of 0.925 g/cm<3> or thereabove and containing 0.001-5.0 wt% of grafted unsaturated carboxylic acid and the like; whereby the difference in acoustic impedance between the main material layer and the bonding material layer is 8.5 x 10<-><3> g/cm<2>. mu sec or thereabove. This multilayer laminated molding is high in barrier properties, and non-destructive detection of the bonding material layer can be easily performed by an ultrasonic wave reflection method. <IMAGE> |
