| 摘要 |
<p>A tape automated bonding feeder apparatus employs a vertical carrier extraction unit (12) to successively supply electronic circuit components to an output station (51) from which a component is seized for placement and attachment to a circuit board. The feeder apparatus, which may be mounted on a rollable cart (501), includes a generally rectilinear housing (10) on a top plate of which one or more magazines (11) are mounted. A magazine contains a stack of circuit component carriers. The bottom of the magazine has a carrier extraction unit which controllably allows an individual component carrier at the bottom of the stack to drop away onto an underlying carrier shuttle (26). The carrier shuttle is supported for movement between the magazine and a lead forming unit (31). The lead forming unit detaches a component from the carrier and forms the leads of the excised component for mounting the component to a circuit board. A processed component transport unit (41) is coupled to an anvil of the lead forming unit and transports a processed component to the output station.</p> |
