Automatic feeding and application of solder to substrate - by passing solder film band below laser which cuts contoured film section which falls onto substrate

摘要

In a process for applying solder to a substrate e.g. electronic components, solder in the form of a continuous film passes between a laser and the substrate below. A predetermined contour is cut from the solder film and falls under gravity onto the preheated substrate below. Control of the laser cutting profile and positioning of the substrate are automatic. USE/ADVANTAGE - The process feeds and applies solder film in a given shape to a substrate, typically electrical components, is automatic and reduces costs.