| 摘要 |
<p>PURPOSE:To improve resistance to the permeation of a contamination source in the environment of a package and resistance to thermal shock at the time of packaging, by forming insulative resin coating layers on the surface and the rear of a pellet. CONSTITUTION:Leads 1 are stretched as far as the vicinity of the circuit forming surface of a pellet 7. Resin coating layers 5 and 6 are formed on the surface and the rear of the pellet 7, respectively. The pellet 7 is fixed to the leads 1 via an insulative film 4. The pellet 7 and the leads 1 are electrically connected by using bonding wires 3. The pellet 7 is bonded to the insulative film 4 by using an insulative film on which adhesive agent is previously spread. As the insulative film, a heat resistant polyimide film wherein activation with contaminants is little is preferable.</p> |
