| 摘要 |
<p>There is disclosed a molding process for plastic IC packages, wherein each of the top and bottom mold halves (302,304) of a mold set (300) are provided with gates (316,326) for injecting liquid molding compound into a cavity (310) formed by the two mold halves (302,304). In this manner, forces exerted by the liquid molding compound are equalized above and below the plane of a die-supporting substrate (18) for forming a body about the semiconductor die (22). During injection of the molding compound the substrate (18) is supported by the peripheral portions of the mold halves (302,304) to avoid desorientation of the die (22) and distortion of bond wires (24). <IMAGE></p> |
