| 摘要 |
<p>PURPOSE:To prevent the generation of cracks in a sealing resin part occurring by thermal stress it the time of soldering onto a circuit board, by forming a heat shielding plate by using a part of a lead frame, on the sealing resin part. CONSTITUTION:After a semiconductor chip is mounted and fixed on a chip mounting part 11 of a lead frame 1, and electrodes of the semiconductor chip and inner leads 12 are connected by using bonding wires, a sealing resin part 2 sealing the chip mounting part 11, the semiconductor chip, the inner leads 12, and suspension leads 14 is formed, and tiebars 15 and a frame part 16 are cut out from outer leads 13 and a heat shielding plate 17. The connection part of the heat shielding plate 17 to the suspension leads 14 is bent and molded, so as to cover the surface of the sealing resin part 2. When this resin seal type semiconductor device is soldered to a circuit board, the heat amount to be transferred to the sealing resin part 2 is reduced by the heat shielding plate 17, so that the generation of cracks in the sealing resin part 2 can be prevented.</p> |
