| 摘要 |
PURPOSE:To improve efficiency of heat dissipation, and reduce the thickness of a semiconductor device, by forming a connection means as a through hole in a substrate, which means connects wirings on the substrate with leads of a lead frame, mounting a semiconductor element directly on one main surface of an island of the lead frame, and exposing the rear of the island of the lead frame to the air. CONSTITUTION:The size of a substrate 7a is made larger than the island of a lead frame to cover leads 5 around the island. Wirings 4 of the substrate 7a and the leads 5 are connected via through holes 9. By this structure, the number of times of connection using bodning wires can be reduced to one-half. Since a semiconductor element 1 is directly fixed to the island 3 of the metal lead frame by using Ag paste or the like, heat dissipation of the element is improved, and a package can be thinned by the thickness of the substrate. |
