HERMETICALLY SEALED MODULE,申请号JP19900291167-传众专利搜索

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发明名称	HERMETICALLY SEALED MODULE
摘要
申请公布号	JPH04163944(A)	申请公布日期	1992.06.09
申请号	JP19900291167	申请日期	1990.10.29
申请人	TOSHIBA CORP	发明人	MOCHIDA HISASHI;TAGUCHI YASUO
分类号	H01L23/04;H02K5/08	主分类号	H01L23/04
代理机构		代理人
主权项
地址

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